|
|
アトメル
|
|
|
映像音響情報通信用IC |
Low-cost USB Hub Controller |
AT43301 |
量産体制
|
32AA/32-lead LQFP |
表面実装
|
-40Cel |
125Cel |
4.4V |
5V |
5.25V |
|
24mA |
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Low-cost USB Hub Controller |
AT43301 |
量産体制
|
32AA/32-lead LQFP |
表面実装
|
-40Cel |
125Cel |
4.4V |
5V |
5.25V |
|
24mA |
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Low-cost USB Hub Controller |
AT43301 |
量産体制
|
24S/24-lead SOIC |
表面実装
|
-40Cel |
125Cel |
4.4V |
5V |
5.25V |
|
24mA |
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Self-and Bus-powered USB Hub Controller |
AT43312A |
量産体制
|
32AA/32-lead LQFP |
表面実装
|
-40Cel |
125Cel |
4.4V |
5V |
5.25V |
|
24mA |
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Self-and Bus-powered USB Hub Controller |
AT43312A |
量産体制
|
32R/32-lead SOIC |
表面実装
|
-40Cel |
125Cel |
4.4V |
5V |
5.25V |
|
24mA |
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Power Management IC for Datacom Platforms |
|
量産体制
|
10 x 10 balls, 0.8mm Pitch BGA Package on 9 x 9mm Body Size |
表面実装
|
-20Cel |
85Cel |
|
5V |
5.5V |
|
500microA |
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Smart Internet Appliance Processor(SIAP) |
AT75C221 |
量産体制
|
BGA256 |
表面実装
|
0Cel |
70Cel |
3V |
3.3V |
3.6V |
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Smart Internet Appliance Processor(SIAP) |
AT75C221 |
量産体制
|
PQFP208 |
表面実装
|
0Cel |
70Cel |
3V |
3.3V |
3.6V |
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
High-Performance Digital Camera Processor |
AT76C113 |
量産体制
|
208-ball BGA |
表面実装
|
|
|
|
1.8V |
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
High-Performance Digital Media Processor |
AT76C113P |
量産体制
|
208-ball BGA |
表面実装
|
|
|
|
1.8V |
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
High-Performance Digital/Video Camera Processor |
AT76C114 |
量産体制
|
280-ball BGA |
表面実装
|
|
|
|
1.8V |
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
High-Performance Digital/Video Camera Processor |
AT76C115 |
量産体制
|
208-ball BGA |
表面実装
|
|
|
|
1.8V |
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
High-Performance Digital Imaging and Video Processor |
AT76C120 |
量産体制
|
208-ball BGA |
表面実装
|
|
|
|
1.8V |
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
802.11b Media Access Controller (MAC) and Baseband with USB Master Capabilities |
AT76C507 |
量産体制
|
144-ball LFBGA |
表面実装
|
|
|
|
1.8V |
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Ethernet to Wireless Bridge Low-Cost Access Point |
AT76C509 |
量産体制
|
208-ball LFBGA |
表面実装
|
|
|
|
1.8V |
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Dual Ethernet to IEEE 802.11b WLAN Bridgeon-a-Chip(DEW-B) |
AT76C511 |
量産体制
|
|
|
|
|
|
|
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
Wireless VoIP Phone-based on the 802.11 Standard Processor |
AT76C901 |
量産体制
|
217-pin PBGA |
表面実装
|
|
|
|
3.3V |
|
|
|
|
|
アトメル
|
|
|
映像音響情報通信用IC |
FingerChip Thermal Fingerprint Sweep Sensor,Hardware Based,Navigation and Click Function,SPI Interface |
AT77C104B |
量産体制
|
Chip On Board(COB) |
|
-40Cel |
85Cel |
2.3V |
3.3V |
3.6V |
4.5mA |
6mA |
|
|
アトメル
|
|
|
映像音響情報通信用IC |
FingerChip Biometric Module |
AT77SM0101BCBO2VKE |
量産体制
|
Chip On Board(COB) |
|
-30Cel |
65Cel |
3V |
3.3V |
3.6V |
200mA |
300mA |
|
|
アトメル
|
|
|
映像音響情報通信用IC |
FingerChip Biometric Module |
AT77SM0101BCBO2VKE |
量産体制
|
Chip On Board(COB) |
|
-30Cel |
65Cel |
3V |
3.3V |
3.6V |
200mA |
300mA |