Package type
14-ball, 3 x 5Array Plastic Chip-scale Ball Grild Array (CBGA)
14C1/14 ball (3x5Array), Plastic Chip-scale Ball Grid Array (CBGA)
14X/14 Lead,0210' Wide, Plastic Thin Shrink Small Outline Package (TSSOP)
20-lead, Plastic J-leaded Chip Carrier (PLCC)
20-lead, Plastic J-leaded chip Carrier (PLCC)
24-ball (5 x 5 Array), 1.0mmPitch, 6 x 8 x1.2mm,Plastic Chip-scale Ball Grid Array (CBGA)
24C1/24 ball (5x5Array), Plastic Chip-scale Ball Grid Array (CBGA)
28-lead, 0.33''Wide,Plastic Gull Wing Small Outline Package (SOIC)
28-lead, Plastic Thin Small Outline Package (TSOP)
28R/28 Lead, 0.330 Wide, Plastic Gull Wing Small Outline Package (SOIC)
28T/28 Lead, Plastic Thin Small Outline Package (TSOP)
28T/28 Lead, Thin Small Outline Package (TSOP)
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, Thin Small Outline Package (TSOP)
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
32-lead, Plastic J-leaded Chip Carrier Package (PLCC)
32-lead, Plastic Thin Small Outline Package (TSOP) (8 x 20 mm)
32-lead, Plastic Thin Small Outline Package (VSOP) (8 x 14 mm)
32J/32 Lead, Plastic J-Leaded Chip Carrier (PLCC)
32J/32 Lead, Plastic J-Leaded Chip Carrier Package (PLCC)
32T/32 Lead, Plastic Thin Small Outline Package (TSOP)
32T/32 Lead, Thin Small Outline Package (TSOP)
32T/32 Lead, Thin Small Outline Package (TSOP) (8x20mm)
32V/32 Lead, Thin Small Outline Package (VSOP) (8x14mm)
40-lead, Thin Small Outline Package (TSOP)
40-lead, Thin Small Outline Package (VSOP) (10 mm x 14 mm)
40T/40 Lead, Plastic Thin Small Outline Package (TSOP)
44-lead, Plastic J-leaded Chip Carrier (PLCC)
44-lead, Plastic J-leaded chip Carrier (PLCC)
44-lead,Thin (1.0 mm) Plstic Quad Flat Package Carrier(TQFP)
44C1/44 ball (5x9 Array), 1.0 mm Pitch, Plastic Chip-scale Ball Grid Array (CBGA)
44J/44 Lead, Plastic J-Leaded Chip Carrier (PLCC)
44R/44 Lead, 0.525 Wide, Plastic Gull Wing Small Outline (SOIC)
46-ball, Plastic Chip-Size Ball Grid Array Package (CBGA)
47-ball, Plastic Chip-Size Ball Grid Array Package (CBGA)
48-ball, Plastic Chip-Size Ball Grid Array Package (CBGA)
48-ball, Plastic Chip-size Ball Grid Array Package (CBGA)
48-lead, Plastic Thin Small Outline Package (TSOP)
48C17/48-ball, Plastic Chip-Size Ball Grid Array Package (CBGA)
48T/48 Lead, Thin Small Outline Package (TSOP)
48T/48-lead, Plastic Thin Small Outline Package (TSOP)
56-ball, Plastic Chip-size Ball Grid Array Package (CBGA)
56-lead, Plastic Thin Small Outline Package (TSOP)
62-ball,Plastic Chip-scale Ball Grid Array (CBGA)
64-ball, Plastic Chip-size Ball Grid Array Package (CBGA)
66-ball, Plastic Chip-scale Ball Grid Array Package (CBGA)
66-ball, Plastic Chip-size Ball Grid Array Package (CBGA)
8-lead, 0.15 W Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.210''Wide,Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-lead, 6 mm x 6 mm x 1 mm,Leadless Array Package(LAP)
8-lead, 6 mm x 6 mm x 1 mm,Leadless Array Package(LAP) - Pin-conpattible with 8-lead SO/VOIC Packages
8-lead, 6.00 mm x 4.90 mm Body,Dual Footprint,Non-leaded,Small Array Package(SAP)
8-pad (6mm x 8mm) Chip Array Small Outline No Lead Package(CASON)
8-pad(6 mm x 8 mm) Chip Array Small Outline No Lead Packege (CASON)
88-ball, Plastic Chip-size Ball Grid Array Package (CBGA)
8CN3/8 pad (6mmx8mm) Chip Array Small Outline No Lead Package (CASON)
8S1/8 Lead, 0.150 Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S1/8 Lead, 0.150Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2/8 Lead, 0.200Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8S2/8 Lead, 0.210 Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8Y4/8 Lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
9C1/9 ball (3x3 Array), 1.0 mm Pitch, 5x5 mm Plastic Chip-scale Ball Grid Array Package (CBGA)