Chip to Board Solution
SI (Signal Integrity)
PI (Power Integrity)
Perform IR drop analysis by SIwave and power supply transient analysis of the power supply by HSPICE,
◎ Detect power supply problems at the early stages of design
◎ Detect problems that are difficult to find in real machine evaluation
◎ Perform What-if analysis and secure the most suitable power route
By performing power integrity analysis like this, we can reduce the number of times we need to create prototypes, and bring products with higher reliability to market in a shorter time.
EMC (Electro-Magnetic Compatibility)
With power plane resonance analysis, we can determine the optimal capacity and the position of frequency dependent decoupling capacitors. In addition, by performing plane resonance analysis of the entire surface of the printed circuit board by SIWave or HFSS, we can determine the optimal layout for the circuit board and chassis.
By performing “EMC design” which applies noise control from the upper processes of design like this, it is possible to eliminate retrogression when designing, and shorten the time taken for empirical measures.
Thermal Fluid Analysis
Thermal fluid analysis software that can simulate 3 types of heat transfer (conduction, convection, radiation): Using Icepak※4, high precision analysis including Joule heat obtained from power supply analysis as well as thermal conductivity distribution of wiring patterns is performed from the early stages of PCB design.
As a result, it is possible to arrange components that are optimal for heat dissipation, and to design patterns that control calorific value. In addition, if there is an element of which calorific value is large compared to the calorific capacity of the printed circuit board, proposals of optimal heat sinks or fans, etc. are also possible. In products where top priority is given to securing heat dissipation, such as products with advanced device mounting where leakage current increases as chip temperature rises, it is recommended to apply the thermal design which is considered from the component placement stage.
NEXTY Electronics Corporation Invests in Ultimate Technologies Incorporated