Discrete > MULTI CHIP DISCRETE DEVICES (51)
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NEXTY sales results
Product lifecycle stage
Package type
Body length[Typ]
Body breadth[Typ]
Body height[Typ]
Mounting method
Collector-emitter voltage[Max] (V)
Collector current (DC)[Max] (A)
Collector current (pulse)[Max] (A)
Gain-bandwidth product[Min] (Hz)
Gain-bandwidth product[Typ] (Hz)
Collector-emitter saturation voltage[Typ] (V)
Collector-emitter saturation voltage[Max] (V)
DC current gain[Min]
DC current gain[Max]
Drain-source voltage[Max] (V)
Drain current (DC)[Max] (A)
Drain current (pulse)[Max] (A)
Gate-source cutoff voltage[Max] (V)
Forward voltage[Typ] (V)
Forward voltage[Max] (V)
Resistance ratio[Min]
Resistance ratio[Nom]
Resistance ratio[Max]
Input resistance[Min] (Ohm)
Input resistance[Nom] (Ohm)
Input resistance[Max] (Ohm)
Peak reverse voltage[Max] (V)
Average rectified current[Max] (A)
Complex component
Internal connection
Drain-source on-resistance[Typ] (Ohm)
Drain-source on-resistance[Max] (Ohm)
Gate-emitter threshold voltage[Min] (V)
Gate-emitter threshold voltage[Max] (V)
Collector-base voltage[Max] (V)
Emitter-base voltage[Max] (V)
Gate-source voltage[Max] (V)
Applied filter
Manufecturer =
Toshiba Corporation Semiconductor

Purchase Number of records to be displayed:
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production SM6 / 1-3K1A 2.9mm 1.6mm 1.1mm
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Scheduled to be discontinued UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production ESV / SON5-P-0.50
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Scheduled to be discontinued UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Scheduled to be discontinued UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production ESV / SON5-P-0.50
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Scheduled to be discontinued UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Scheduled to be discontinued UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Scheduled to be discontinued UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES New design not recommended SMV / 2-3L1S 2.9mm 1.6mm 1.1mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Mass production UFV / 2-2R1S 2mm 1.7mm 0.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Scheduled to be discontinued UFV / 1-2AA1S 2.0mm 1.7mm Surface mount technology
Toshiba Corporation Semiconductor
MULTI CHIP DISCRETE DEVICES Scheduled to be discontinued UF6 / 2-2T1S 2.0mm 1.7mm 0.7mm Surface mount technology