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Microchip Technology

Part number	Manufecturer	Product's class name	Product name	Family or series name	Product lifecycle stage	Package type	Mounting method	Supply current[Typ]	Supply current[Max]	Operating ambient temperature[Min]	Operating ambient temperature[Max]	Supply voltage[Min]	Supply voltage[Max]
HCS101-I/P	Microchip Technology	FUNCTIONAL BLOCKS	Fixed Code Encoder	HCS101	Advance preparation	8-lead Plastic DIP(300mil Body)	PCB insertion		2mA	-40Cel	85Cel	3.5V	13.3V
HCS101-I/SN	Microchip Technology	FUNCTIONAL BLOCKS	Fixed Code Encoder	HCS101	Advance preparation	8-lead Plastic SOIC(150mil Body)	Surface mount technology		2mA	-40Cel	85Cel	3.5V	13.3V
HCS101/P	Microchip Technology	FUNCTIONAL BLOCKS	Fixed Code Encoder	HCS101	Advance preparation	8-lead Plastic DIP(300mil Body)	PCB insertion		2mA	0Cel	70Cel	3.5V	13.3V
HCS101/SN	Microchip Technology	FUNCTIONAL BLOCKS	Fixed Code Encoder	HCS101	Advance preparation	8-lead Plastic SOIC(150mil Body)	Surface mount technology		2mA	0Cel	70Cel	3.5V	13.3V
HCS101T-I/P	Microchip Technology	FUNCTIONAL BLOCKS	Fixed Code Encoder	HCS101	Advance preparation	8-lead Plastic DIP(300mil Body)	PCB insertion		2mA	-40Cel	85Cel	3.5V	13.3V
HCS101T-I/SN	Microchip Technology	FUNCTIONAL BLOCKS	Fixed Code Encoder	HCS101	Advance preparation	8-lead Plastic SOIC(150mil Body)	Surface mount technology		2mA	-40Cel	85Cel	3.5V	13.3V
HCS101T/P	Microchip Technology	FUNCTIONAL BLOCKS	Fixed Code Encoder	HCS101	Advance preparation	8-lead Plastic DIP(300mil Body)	PCB insertion		2mA	0Cel	70Cel	3.5V	13.3V
HCS101T/SN	Microchip Technology	FUNCTIONAL BLOCKS	Fixed Code Encoder	HCS101	Advance preparation	8-lead Plastic SOIC(150mil Body)	Surface mount technology		2mA	0Cel	70Cel	3.5V	13.3V
HCS200-I/P	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder	HCS200	Mass production	8-lead Plastic DIP(300mil)	PCB insertion	8mA	12mA	-40Cel	85Cel	3.5V	13V
HCS200-I/SN	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder	HCS200	Mass production	8-lead Plastic SOIC(150mil)	Surface mount technology	8mA	12mA	-40Cel	85Cel	3.5V	13V
HCS200/P	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder	HCS200	Mass production	8-lead Plastic DIP(300mil)	PCB insertion	8mA	12mA	0Cel	70Cel	3.5V	13V
HCS200/SN	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder	HCS200	Mass production	8-lead Plastic SOIC(150mil)	Surface mount technology	8mA	12mA	0Cel	70Cel	3.5V	13V
HCS200T-I/P	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder	HCS200	Mass production	8-lead Plastic DIP(300mil)	PCB insertion	8mA	12mA	-40Cel	85Cel	3.5V	13V
HCS200T-I/SN	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder	HCS200	Mass production	8-lead Plastic SOIC(150mil)	Surface mount technology	8mA	12mA	-40Cel	85Cel	3.5V	13V
HCS200T/P	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder	HCS200	Mass production	8-lead Plastic DIP(300mil)	PCB insertion	8mA	12mA	0Cel	70Cel	3.5V	13V
HCS200T/SN	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder	HCS200	Mass production	8-lead Plastic SOIC(150mil)	Surface mount technology	8mA	12mA	0Cel	70Cel	3.5V	13V
HCS201	Microchip Technology	FUNCTIONAL BLOCKS	KEELOQ Code Hopping Encoder		Mass production	8-lead PDIP(300mil)/8-lead SOIC(150mil)	Surface mount technology	1.5mA	2mA	0Cel	70Cel	3.5V	13V
HCS201-I/P	Microchip Technology	FUNCTIONAL BLOCKS			Advance preparation	8-lead Plastic DIP
HCS201-I/SN	Microchip Technology	FUNCTIONAL BLOCKS			Advance preparation	8-lead Plastic SOIC
HCS201/P	Microchip Technology	FUNCTIONAL BLOCKS			Advance preparation	8-lead Plastic DIP