Product details
Part number | BGF104 |
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Product name | HSMMC Interface Filter and ESD Protection |
Manufacturer | Infineon Technologies |
Technical file | |
EDA/CAD | |
Product overview | ESD protection and filter for High Speed. Multi Media Card interface. ESD protection:15kV max.16pin green wafer level package with SnAgCu solder balls. 500microm solder ball pitch. 300microm solder ball diameter |
Attribute name | Attribute value |
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Creation date | 2005-12-05 |
Last revised date | 2005-12-05 |
Class code | XJA755 |
Product's class name | CIRCUIT PROTECTORS |
Product lifecycle stage | Mass production |
Application scope | ESD protection and filter for High Speed. Multi Media Card interface. ESD protection:15kV max.16pin green wafer level package with SnAgCu solder balls. 500microm solder ball pitch. 300microm solder ball diameter |
Package type | WLP-16-1 |
Mounting method | Surface mount technology |
Resetting | auto reset |